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CVE DATABASE  /  CVE-2026-21385

CVE-2026-21385

Qualcomm Multiple Chipsets Memory Corruption Vulnerability

CVSS 7.8 · HIGH ⚠ CISA KEV — ACTIVELY EXPLOITED
On the CISA KEV catalog

Confirmed exploited in the wild. Added 2026-03-03. Federal remediation due 2026-03-24.
Required action: Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.

Summary

Memory corruption while using alignments for memory allocation.

CVSS 3.1 breakdown

Base score7.8 (HIGH)
VectorCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Attack vectorLOCAL
Attack complexityLOW
Privileges requiredLOW
User interactionNONE
ScopeUNCHANGED
ConfidentialityHIGH
IntegrityHIGH
AvailabilityHIGH

Weakness type (CWE)

Affected products

Qualcomm sm7675p firmwareQualcomm sm7675pQualcomm sm8475p firmwareQualcomm sm8475pQualcomm sm8550p firmwareQualcomm sm8550pQualcomm sm8635 firmwareQualcomm sm8635Qualcomm sm8635p firmwareQualcomm sm8635pQualcomm sm8650q firmwareQualcomm sm8650qQualcomm sm8750p firmwareQualcomm sm8750pQualcomm smart audio 400 platform firmwareQualcomm smart audio 400 platformQualcomm smart display 200 platform firmwareQualcomm smart display 200 platformQualcomm snapdragon 4 gen 1 mobile platform firmwareQualcomm snapdragon 4 gen 1 mobile platform
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References

Data: NIST NVD + CISA KEV. NVD last modified 2026-03-04. Always verify against the vendor advisory before acting.

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